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rf & protection devices data sheet revision 3.3, 2010-06-24 BGB717L7ESD sige:c low noise amplifier mm ic for fm radio applications
edition 2010-06-24 published by infineon technologies ag 81726 munich, germany ? 2010 infineon technologies ag all rights reserved. legal disclaimer the information given in this docu ment shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infine on technologies hereby disclaims any and all warranties and liabilities of any kind, including witho ut limitation, warranties of non-infrin gement of intellectua l property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies compon ents may be used in life-su pport devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safe ty or effectiveness of that de vice or system. life support devices or systems are intended to be implanted in the hu man body or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BGB717L7ESD data sheet 3 revision 3.3, 2010-06-24 trademarks of infineon technologies ag bluemoon?, comneon?, c166 ?, crossave?, canpak?, cipos? , coolmos?, coolset?, corecontrol?, dave?, easypim?, econobridg e?, econodual?, eco nopack?, econopim?, eicedriver?, eupec?, fcos?, hitfet?, hybridpack?, isofac e?, i2rf?, isopack?, mipaq?, modstack?, my-d?, novalithic?, omnitune?, optimos?, origa?, profet?, pro-sil?, primarion?, primepac k?, rasic?, reversave? , satric?, sensonor?, sieget?, sindrion?, smarti?, smartlewis?, tempfet? , thinq!?, tricore?, trenchstop?, x-go ld?, xmm?, x-pmu?, xposys?. other trademarks advance design system? (ads) of agilent tech nologies, amba?, arm?, mu lti-ice?, primecell?, realview?, thumb? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus? , firstgps? of trimble navigation ltd. emv? of emvco, llc (visa holdings inc.). ep cos? of epcos ag. flexgo? of microsoft corporation. flexray? is licensed by flexra y consortium. hyperterminal? of hilgraeve incorpor ated. iec? of commission electrotechnique internationale. irda? of infrared data association corporation. iso? of international organization for standardizati on. matlab? of mathworks, inc. maxim? of maxim integrated products, inc. mi crotec?, nucleus? of mentor graphi cs corporation. mifare? of nxp. mipi? of mipi alliance, inc. mips? of mips technologies, inc., usa. murata? of murata manufacturing co., microwave office? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. openwave? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of si rius sattelite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of symbian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. tektro nix? of tektronix inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilo g?, palladium? of cadence design systems, inc. vlynq? of texas instruments incorpor ated. vxworks?, wind river? of wind ri ver systems, inc. zetex? of diodes zetex limited. last trademarks update 2010-03-22 revision history page / item subjects (major changes since last revisions) revision 3.3, 2010-06-24 converted to the new ifx template. revision 3.2 supply voltage limited to 4.0 v
BGB717L7ESD table of contents data sheet 4 revision 3.3, 2010-06-24 table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 list of figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 list of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2product brief . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 operation conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.1 dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.2 ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table of contents
BGB717L7ESD list of figures data sheet 5 revision 3.3, 2010-06-24 figure 1 pinning of BGB717L7ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 2 total power dissipation p tot = f ( t s ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 3 fm radio testing circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 4 package outline tslp-7-1 (bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 5 footprint tslp-7-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 6 marking of tslp-7-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 7 tape of tslp-7-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 list of figures
BGB717L7ESD list of tables data sheet 6 revision 3.3, 2010-06-24 table 1 pinning table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 2 maximum ratings at t a = 25c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 3 thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 4 operation conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 5 dc characteristics at t a = 25 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 6 bill of material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 7 ac characteristics in the fm radio lna application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 list of tables
product name package marking BGB717L7ESD tslp-7-1 ax sige:c low noise amplif ier mmic for fm radio applications BGB717L7ESD data sheet 7 revision 3.3, 2010-06-24 1 features main features: ? high performance fm radio lna with integrated biasing ? worldwide fm band support (76 mhz to 108 mhz) ? integrated esd protection for all pins (3 kv for rf input vs. gnd, 2 kv for all other pin combinations, hbm) ? very high gain at low current consumption ? high input compression point ? high input impedance ? excellent noise figure from latest sige:c technology ? integrated active biasing circuit en ables stable operation point against temperature- and processing-variations ? minimum external components ? operation voltage: 1.8 v to 4.0 v ? power-off function ? very small and leadless package tslp-7-1, 2.0 x 1.3 x 0.4 mm ? pb-free (rohs complia nt) and halogen-free (w eee compliant) package applications ? active fm antenna systems ? portable fm radio ? personal headphone radio ? ism applications
BGB717L7ESD product brief data sheet 8 revision 3.3, 2010-06-24 2 product brief the BGB717L7ESD is an advanced low noise amplifier mmi c with integrated esd protection and active biasing specifically designed for fm antenna systems requirin g high gain, reduced power consumption and very low distortion. the external components determine the gain of the fm amplifier and can also be modified to extend the operating frequency. the device is based upon infineon technologies cost effective sige:c technology and comes in a low profile tslp-7-1 leadless green package. figure 1 pinning of BGB717L7ESD table 1 pinning table pin function 1gnd 2rf-in 3bias-out 4 ctrl on/off 5rf-out 6 v cc 7gnd 1 2 3 6 5 4 7
BGB717L7ESD maximum ratings data sheet 9 revision 3.3, 2010-06-24 3 maximum ratings attention: stresses above the max. values listed here may cause permanent damage to the device. exposure to absolute maximum rating conditions for extended periods may affect device reliability. maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. table 2 maximum ratings at t a = 25c parameter symbol value unit note / test condition min. typ. max. supply voltage v cc ??4.0v? t a = -55c ? 3.5 supply current at vcc pin i cc ??25ma? idc current at rf-in pin i b ??3ma? control on / off voltage v ctrl ??4.0v? total power dissipation 1) t s 112 c 2) 1) t s measured at the gnd pin (7) at soldering point to the pcb 2) t s soldering point temperature p tot ? ? 100 mw ? operation junction temperature t jop -55 ? 150 c ? storage temperature t stg -55 ? 150 c ? esd capability human body model jesd22-a114-b ? ? ? 2000 v ? machine model jesd22-a115-a ? ? ? 100 v ? charge device model jesd22- c101-c ? ? ? 1500 v ?
BGB717L7ESD thermal characteristics data sheet 10 revision 3.3, 2010-06-24 4 thermal characteristics figure 2 total power dissipation p tot = f ( t s ) 5 operation conditions table 3 thermal resistance parameter symbol values unit note / test condition min. typ. max. junction - soldering point 1) 1) for calculation of r thja please refer to application note thermal resistance r thjs ? 375 ? k/w ? table 4 operation conditions parameter symbol values unit note / test condition min. typ. max. supply voltage v cc 1.83.04.0v? voltage ctrl on/off pin in on mode v ctrl-on 1.23.04.0v? voltage ctrl on/off pin in off mode v ctrl-off -0.3 0 0.3 v ? 0 20 40 60 80 100 120 0 50 100 150 ts [c] ptot [mw]
BGB717L7ESD electrical characteristics data sheet 11 revision 3.3, 2010-06-24 6 electrical characteristics 6.1 dc characteristics 6.2 ac characteristics this section presents the ac charac teristics of the BGB717L7ESD as measured in a high-ohmic fm radio application circuit using a pcb and a population as de scribed in the application note an176. please consult our website to download the application note: www.infineon.com/rf.appnotes . the application schematic is shown in figure 3 and the function of each component is explained in table 6 . figure 3 fm radio testing circuit table 5 dc characteristics at t a = 25 c parameter symbol values unit note / test condition min. typ. max. supply current i cc 2.43.03.6ma v cc = 3 v v ctrl = 3 v small signal operation supply current in off mode i cc-off ?16 a v cc = 4.0 v v ctrl = 0 v current into ctrl on/off pin in on mode i ctrl-on ?1420 a v cc = 3 v v ctrl = 3 v current into ctrl on/off pin in off mode i ctrl-off ??0.1 a v cc = 4.0 v v ctrl = 0 v 2 3 6 5 4 1 v cc rf-in on /off bias-out rf-out gnd r 1 rfin bgb717esd 7 c 3 v cc c 1 l 1 c 2 v ctrl c 4 r 2 rfout gnd BGB717L7ESD_application_circuit
BGB717L7ESD electrical characteristics data sheet 12 revision 3.3, 2010-06-24 the following table gives an overview on the performance of the fm radio lna application circuit. all data were measured in a 50 system. table 6 bill of material component value manufacturer / type function c 1 330 pf various / 0402 dc blocking c 2 47 nf various / 0402 dc stabilization c 3 47 nf various / 0402 dc stabilization c 4 330 pf various / 0402 dc blocking r 1 56 various / 0402 for biasing, output matching and stabilization r 2 10 various / 0402 for output matching and stabilization l 1 470 nh taiyo yuden lk1608r47k-t / 0603 rf choke table 7 ac characteristics in the fm radio lna application 1) 1) as described in an176, t a = 25c, v cc = 3 v, v ctrl = 3 v, i cc = 3 ma, f = 100 mhz parameter symbol values unit note / test condition min. typ. max. insertion power gain | s 21 | 2 10 12 14 db ? input return loss 2) 2) verified by random sampling rl in 00.5 3) 3) high lna input impedance leads to power matching with high ohmic antennas 3db? output return loss 2) rl out 13 16 4) 4) output matching is accomplished by the external resistors r1 and r2 19 db ? noise figure 5) 5) an aggressive low pass filter prevents radio broad cast signals from distorting the nf measurement f 50 ?1.01.5db z s = 50 input 1db gain compression point 2) ip -1db -8.0 -5.5 ? dbm ? input 3 rd order intercept point 2) iip 3 -15.5 -12.5 ? dbm p rfin = -40 dbm
BGB717L7ESD package information data sheet 13 revision 3.3, 2010-06-24 7 package information figure 4 package outline tslp-7-1 (bottom view) figure 5 footprint tslp-7-1 figure 6 marking of tslp-7-1 figure 7 tape of tslp-7-1 0.05 max. +0.1 0.4 1) dimension applies to plated terminal 0.035 1.2 0.05 1 0.05 1.3 0.05 1.7 0.05 2 6 x 0.2 0.035 1) 6 x 0.2 0.035 1) 0.035 1.1 1) 456 1 2 3 7 1) top view bottom view pin 1 markin g tslp-7-1-po v04 0.25 1.4 1.9 0.25 0.2 0.25 0.25 0.2 1.4 1.9 0.3 0.3 0.3 0.2 0.2 0.2 0.2 0.2 stencil apertures copper solder mask r0.1 0.25 1.4 1.9 0.25 0.2 0.25 0.25 0.2 1.4 1.9 0.3 0.3 0.3 0.2 0.2 0.2 0.2 0.2 stencil apertures copper solder mask r0.1 smd nsmd tslp-7-1-fp v01 ax ax tslp-7-1-tp v0 3 1.45 4 8 2.18 0.5 pin 1 marking
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